We are thrilled to announce that Holy Child Central Colleges, Inc. has officially forged a strategic partnership with Curtin University, Malaysia, through a π΄πππππππ ππ ππ πΌππ πππππππ πππ (π΄πΆπΌ) signed on September 3, 2024. This collaboration marks a significant step in our ongoing commitment to providing global education and broadening the horizons of our students and faculty.
This partnership is set to unlock a wealth of global opportunities for our students, significantly enriching their academic and cultural experiences. By joining forces, HCCCI and Curtin University, Malaysia, will share resources, expertise, and knowledge, creating a dynamic and collaborative environment that will benefit both students and faculty. The collaboration underscores our dedication to fostering an educational ecosystem that is not only innovative but also globally connected.
The MOU was officially signed by Professor Simon Leunig, Pro Vice-Chancellor & President, Chief Executive of Curtin University, Malaysia. Representing HCCCI, Marivet S. Caballero, President, was represented by Vanessa Marie L. Antiquin, MMEM, Executive Vice President. The signing ceremony was witnessed by Professor Roy Rillera Marzo, Dean of the Faculty of Humanities and Health Sciences at Curtin University, Malaysia, alongside Professor Erwin M. Faller, Academic Director of Holy Child Central Colleges, Inc.
This partnership aligns seamlessly with HCCCI's mission of internationalization, nurturing globally competitive students who are well-equipped to face future challenges. We believe that this collaboration will open new doors for our school community, enabling them to engage in enriching academic pursuits and thrive in an interconnected world.
Stay tuned for more updates on the exciting opportunities this partnership will bring to our students and the entire HCCCI community
For local, national, or international institutions, offices, and agencies interested in partnering through the COIL or Exchange program, please click the link below to complete a pre-application form: https://forms.office.com/r/RcNcMYwbJc